Heterogeneous Mobile Processing & Computing Market by Component (processor, GPU, DSP, connectivity), Technology Node (45NM-5NM), Application (Consumer, Tele-communication, Automotive, MDA, Medical), & Geography - Forecast & Analysis to – 2020
The
total Heterogeneous Mobile Processing & Computing market is expected to
reach $61.70 Billion by 2020, growing at a CAGR of 20.75% from 2014 to 2020.
Browse 84 market data Tables and 46 Figures spread through
271 Pages and in-depth TOC on "Heterogeneous Mobile Processing &
Computing Market by Component (processor, GPU, DSP, connectivity), Technology
Node (45NM-5NM), Application (Consumer, Tele-communication, Automotive, MDA,
Medical), & Geography - Forecast & Analysis to 2014–2020"
Some
of the key players in this market include ARM Holdings Plc. (U.K.), Auviz
Systems (U.S.), Advanced Micro Devices Inc. (U.S.), Imagination Technologies
Group Plc. (U.K.), Media Tek Inc.( Taiwan), Qualcomm Inc.(U.S.), Texas
Instruments Inc.(U.S.), and Samsung Electronics Co. Ltd.( South Korea).
The System on Chip (SoC) component types are classified into
hardware and software components. The hardware components are sub segmented as
processors, GPUs (Graphic Processing Units), DSPs (Digital Signal Processor),
and other connectivity solutions (Wi-Fi, Bluetooth). The software components
consist of the programming languages, and middleware tools such as Open CL,
C/C++, Open VX which are being used in the development of heterogeneous
processing platforms. With a large number of benefits, the market is gaining
increased visibility in a variety of applications like consumer electronics,
tele -communications, medical, automotive, and military and defense. The report
provides detailed analysis of the current market scenario and estimation till
2020.
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Scope
of the report
This
research report categorizes the Heterogeneous Mobile Processing market based on
different components, technology nodes, applications, and geographical
analysis, forecasting revenue, and analyzing trends in the market.
Market
by System on Chip (SoC) component
The
HMP and Heterogeneous Mobile computing market by System on Chip (SoC) component
is divided into hardware and software components. The hardware components are
further sub divided into processors, GPUs (Graphic Processing Units), DSPs
(Digital Signal Processor), connectivity solutions (such as Wi-Fi, Bluetooth, network
processors), and other components consisting of Field-Programmable Gate Array
(FPGA) IC, sensors, Video Signal Processor (VSP), and multimedia engine.
Market
by technology node
The
System on Chip (SoC) is classified by the technology nodes which are 45nm,
28nm, 14nm, 10nm, 7nm, and nm
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