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Heterogeneous Mobile Processing & Computing Market by Component (processor, GPU, DSP, connectivity), Technology Node (45NM-5NM), Application (Consumer, Tele-communication, Automotive, MDA, Medical), & Geography - Forecast & Analysis to – 2020



The total Heterogeneous Mobile Processing & Computing market is expected to reach $61.70 Billion by 2020, growing at a CAGR of 20.75% from 2014 to 2020.

Browse 84 market data Tables and 46 Figures spread through 271 Pages and in-depth TOC on "Heterogeneous Mobile Processing & Computing Market by Component (processor, GPU, DSP, connectivity), Technology Node (45NM-5NM), Application (Consumer, Tele-communication, Automotive, MDA, Medical), & Geography - Forecast & Analysis to 2014–2020"

Some of the key players in this market include ARM Holdings Plc. (U.K.), Auviz Systems (U.S.), Advanced Micro Devices Inc. (U.S.), Imagination Technologies Group Plc. (U.K.), Media Tek Inc.( Taiwan), Qualcomm Inc.(U.S.), Texas Instruments Inc.(U.S.), and Samsung Electronics Co. Ltd.( South Korea).

 The System on Chip (SoC) component types are classified into hardware and software components. The hardware components are sub segmented as processors, GPUs (Graphic Processing Units), DSPs (Digital Signal Processor), and other connectivity solutions (Wi-Fi, Bluetooth). The software components consist of the programming languages, and middleware tools such as Open CL, C/C++, Open VX which are being used in the development of heterogeneous processing platforms. With a large number of benefits, the market is gaining increased visibility in a variety of applications like consumer electronics, tele -communications, medical, automotive, and military and defense. The report provides detailed analysis of the current market scenario and estimation till 2020.

 
Scope of the report

This research report categorizes the Heterogeneous Mobile Processing market based on different components, technology nodes, applications, and geographical analysis, forecasting revenue, and analyzing trends in the market.

Market by System on Chip (SoC) component

The HMP and Heterogeneous Mobile computing market by System on Chip (SoC) component is divided into hardware and software components. The hardware components are further sub divided into processors, GPUs (Graphic Processing Units), DSPs (Digital Signal Processor), connectivity solutions (such as Wi-Fi, Bluetooth, network processors), and other components consisting of Field-Programmable Gate Array (FPGA) IC, sensors, Video Signal Processor (VSP), and multimedia engine.

Market by technology node

The System on Chip (SoC) is classified by the technology nodes which are 45nm, 28nm, 14nm, 10nm, 7nm, and nm


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