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Wireless Connectivity Market : Opportunities , Market Dynamics , Challenges and Trends

[188 Pages Report] The wireless connectivity market was valued at USD 44.34 Billion in 2017 and is expected to reach USD 95.66 Billion by 2023, at a CAGR of 13.42% during the forecast period. The base year considered for this study is 2017, and the forecast period is between 2018 and 2023.
This report covers the wireless connectivity market segmented on the basis of connectivity technology, type, and geography. In terms of connectivity technology, LTE Cat-M1 is expected to grow at highest CAGR during the forecast period. The increase in the adoption of IoT/M2M communication solutions, rise in the demand for longer connectivity, and need for low-power consumption and low-cost connectivity technologies are driving the market for chipsets based on LTE Cat-M1 technology.
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The market for Wi-Fi–enabled chipsets is expected to hold the largest size of the wireless connectivity market in APAC between 2018 and 2023. The increase in the penetration of smartphones in the middle-class population in emerging economies, such as India, Indonesia, and other Southeast Asian countries, is boosting the growth of the market for connected devices based on Wi-Fi technology.

In terms type, the market for cellular expected to hold the largest size of wireless connectivity market between 2018 and 2023. The government projects related to smart cities and the development proposals for the existing utility infrastructure are expected to boost the cellular M2M market during the forecast period. Over the next 5 years, cellular M2M technology is expected to be largely employed for smart metering solutions.

The companies that are profiled in the report are Qualcomm (US), Intel (US), Broadcom (US), MediaTek (Taiwan), Texas Instruments (US), Cypress Semiconductor (US), NXP Semiconductors (Netherlands), and STMicroelectronics (Switzerland), Microchip (US), and EnOcean (Germany). The market also covers other players such as NEXCOM (Taiwan), Skyworks Solutions (US), Murata Manufacturing (Japan), Marvell Technology (US), Quantenna Communications (US), Renesas Electronics (Japan), Nordic Semiconductor (Norway), Ceva (US), Espressif Systems (China), Peraso Technologies (Canada).

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