Chiplet Market Size, Share, Industry Growth Report, Opportunities to 2028
The chiplet market is projected to grow from USD 6.5 billion in 2023 and is estimated to reach USD 148.0 billion by 2028; it is expected to grow at a Compound Annual Growth Rate (CAGR) of 86.7% from 2023 to 2028. The growth of the chiplet market is driven by adoption of advanced packaging technologies, and proliferation of data centers worldwide.
Applications Across Industries:
Data Centers and Cloud Computing: In data center applications, chiplets enable the creation of highly specialized and optimized processors tailored to specific workloads such as artificial intelligence (AI), machine learning (ML), and data analytics. By combining CPU, GPU, AI accelerator, and memory chiplets, data center operators can achieve higher performance, energy efficiency, and scalability compared to traditional monolithic designs.
Consumer Electronics: In the consumer electronics market, chiplets enable the development of high-performance and energy-efficient devices such as smartphones, tablets, and wearables. By integrating chiplets for processors, graphics, connectivity, and sensors, device manufacturers can deliver advanced features and functionalities while reducing time-to-market and development costs.
Automotive: In the automotive industry, chiplets play a crucial role in enabling the development of advanced driver assistance systems (ADAS), autonomous vehicles, and in-vehicle infotainment (IVI) systems. By integrating chiplets for image sensors, radar modules, processing units, and communication interfaces, automotive manufacturers can enhance safety, performance, and user experience in next-generation vehicles.
IoT and Edge Computing: In the Internet of Things (IoT) and edge computing applications, chiplets enable the development of compact and power-efficient devices for smart homes, industrial automation, and smart cities. By integrating chiplets for sensors, processors, and wireless connectivity, IoT device manufacturers can deploy scalable and customizable solutions that meet the diverse requirements of IoT deployments.
Trends Shaping the Market:
Heterogeneous Integration: Chiplet-based designs enable heterogeneous integration of diverse semiconductor components such as CPUs, GPUs, memory, and accelerators onto a single package or substrate. This approach allows designers to optimize performance, power consumption, and area (PPA) by selecting the best-suited chiplets for each function, resulting in highly efficient and specialized SoC solutions.
Interconnect Technologies: Interconnect technologies play a critical role in chiplet-based designs, facilitating communication and data exchange between individual chiplets within a package or system. Advanced interconnect technologies such as silicon interposers, 2.5D/3D packaging, and high-bandwidth memory (HBM) interfaces enable high-speed and low-latency communication between chiplets, unlocking the full potential of heterogeneous integration.
Standardization and Ecosystem Development: Standardization efforts and ecosystem development initiatives are driving adoption and interoperability in the Chiplet market. Industry consortia such as the Chiplet Interconnect Protocol (CIP) Consortium and the Open Compute Project (OCP) are developing open standards and specifications for chiplet-based designs, enabling interoperability and ecosystem growth across vendors and applications.
Design and Manufacturing Scalability: Design and manufacturing scalability are key considerations in chiplet-based designs, especially for complex SoC solutions with multiple chiplets. Design automation tools, verification methodologies, and manufacturing processes are evolving to support chiplet-based designs, enabling designers to efficiently prototype, validate, and mass-produce chiplet-integrated systems.
Key companies operating in the chiplet market are Intel Corporation (US), Advanced Micro Devices, Inc. (US), Apple Inc. (US), IBM (US), Marvell (US), MediaTek Inc. (Taiwan), NVIDIA Corporation (us), Achronix Semiconductor Corporation (US), Ranovus (Canada), and ASE Technology Holding Co., Ltd. (Taiwan).
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