Wireless Connectivity Market Type (WLAN, WPAN, LPWAN), and Geography - Global Forecast to 2023

[188 Pages Report] The wireless connectivity market was valued at USD 44.34 Billion in 2017 and is expected to reach USD 95.66 Billion by 2023, at a CAGR of 13.42% during the forecast period. The base year considered for this study is 2017, and the forecast period is between 2018 and 2023.

Objectives of the Study

• To define, describe, and forecast the wireless connectivity market, in terms of value and volume, segmented on the basis of connectivity technology, type, and geography
• To forecast the market size, in terms of value and volume, for various segments with respect to 4 main regions, namely, North America, Europe, Asia Pacific (APAC), and Rest of the World (RoW)
• To provide detailed information and analysis of major factors influencing the market growth (drivers, restraints, opportunities, and challenges)
• To strategically analyze the micromarkets1 with respect to individual growth trends, prospects, and contributions to the total market
• To provide a detailed overview of the value chain of the ecosystem of wireless connectivity solutions
• To analyze opportunities in the market for stakeholders by identifying high-growth segments of the wireless connectivity market
• To strategically profile the key players and comprehensively analyze their market positions in terms of ranking and core competencies2, along with detailing the competitive landscape for market leaders
• To analyze growth strategies such as product launches and developments, acquisitions, expansions, and agreements adopted by the major players in the wireless connectivity market
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The research methodology used to estimate and forecast the wireless connectivity market begins with capturing data on key vendor revenues through secondary research. The secondary sources include research papers and journals of ZigBee Alliance, IEEE Association (US), Bluetooth Special Interest Group (US), Wi-Fi Alliance (US), Global Semiconductor Alliance (US), Semiconductor Industry Association (US), European Semiconductor Industry Association, Belgium (ESIA), and MarketsandMarkets Analysis. Moreover, vendor offerings have been taken into consideration to determine the market segmentation. The bottom-up procedure has been employed to arrive at the size of the overall wireless connectivity technologies from the revenue of the key players in this market.

 After arriving at the overall market size, the total market has been split into several segments and subsegments, which have been verified through primary research by conducting extensive interviews with key experts such as CEOs, VPs, directors, and executives. The data triangulation and market breakdown procedures have been employed to complete the overall market engineering process and arrive at the exact statistics for all segments and subsegments. The breakdown of the profiles of primary respondents is depicted in the following figure.